TECHNOLOGY
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International Tin Association members visited Shenzhen Vital New Material Company Limited
OnApril21,2017,themembersoftheInternationalAssociationofTinAssociationsvisitedShenzhenWeiteNewMaterialsCo.,Ltd.(hereinafterreferredtoas“Victor”)inLonggangDistrict,Shenzhen.Atotalof10membercompaniesvisitedVictaulic..Mr.LiaoGaobing,ChairmanofVictaulic,expressedhiswarmwelcometothemembers'visitsandlookedforwardtodeepeningmutualunderstandingthroughthisvisittopromoteexchangesbetweentheupstreamanddownstreamindustriesofthetinindustry.Mr.Liaointroducedthecompany'ssituationanddevelopmentprocess.Onlyafter19yearsofestablishment,thecompanyhasbeenstrivingtobecomethecoremissionoftheglobalmicroelectronicsweldingmaterialsystemsolutionprovider,andsharedthecorevaluesoftheuniqueandgratefulreturn.Abeautifulvisionforbuildingaharmonioushome.Mr.LiaoGaobingSubsequently,Mr.LiaoledChinesememberstovisittheproductionworkshopofVictaulic,andintroducedindetailthehardwarefacilitiesequippedwithfirst-class,high-precisionandenergy-saving.TheChinesemembersalsovisitedtheR&DTestingEngineeringCenterofVictaulic.WespecializeinR&Dasthecorecompetitivenessofthecompany.Eachyear,weinvestinR&Dwithasalesincomeofmorethan5%.70%ofitisusedinthecurrentmarket,30%isusedinfuturemarkettrenddevelopmentandtechnologyreserves,anddrivenbytechnology.High-reliabilityandenvironmentally-friendlyproductsaregraduallyenteringtheinternationalmarketbythedomesticmarket,thusrealizingtheuniqueinternationalizationofthecompanyandmakingmorecustomersprofitable.Throughthevisit,themembershadafullexchangewiththeseniorexecutivesofWeiTe,andlookedforwardtoestablishingaclosercooperativerelationshipwithVictaulic.WearealsogratefultoVictaulicfortheirsupportofChina'smembershipactivities,andwelookforwardtothememberstobuildabrightfutureforthetinindustry.AboutVictaulicFoundedin1998,ShenzhenWeiteNewMaterialCo.,Ltd.isheadquarteredinBaolongStreet,LonggangDistrict.Ithasmorethan100,000squaremetersoflarge-scalemodernproductionandR&DbasesinLonggang,HuizhouandSuzhou.Itsmainproductsaresolderpaste.,solderingflux,solderbar,solderwireandotherelectronicsolderingmaterials.Ithasestablishedlong-termcooperativerelationshipswithmorethan400companiesinmorethan30countriesaroundtheworld.AboutChinesemembersThemembersoftheInternationalTinAssociationaremainlycomposedoftinsmeltingenterprises,tinconsumerenterprisesandtradingenterprises,ofwhichsmeltingenterprisesaccountformorethan80%ofthenationaltinsmeltingoutput.Throughthequarterlymeetings,mutualvisitsandresearchandstudyorganizedbyoursubsidiaries,membercompanieshavebroadenedtheirhorizons,promotedcorporatecooperationandinternationalexchanges,andcreatedfavorableconditionsforenterprisestoimprovetheirdevelopment.Mostofourmembercompaniesareleadingcompaniesintheindustry,adheringtotheconceptofsustainabledevelopmentoftheInternationalTinAssociation,jointlymaintainingtheindustryorderandcreatingabetterfuturefortheindustry!
2017-05-04
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Vital invites you to participate in the Hefei Seminar on Advanced Intelligent Manufacturing and Reliability Engineering Technology
CEIA China Electronic Intelligent Manufacturing Series Forum, the first innovative offline online all-round activity platform in China, has become the TED of China's electronics manufacturing industry, focusing on Industry 4.0, China Manufacturing 2025, and the main line of electronic intelligent manufacturing, promoting China's electronic intelligent manufacturing innovation. Application, promote the upgrading and development of China's electronics manufacturing industry. In 2017, advanced intelligent manufacturing and reliability engineering technology will be held in Chongqing, Hefei, Qingdao, Hangzhou, Xi'an, Wuhan, Beijing, Suzhou and Shanghai. The offline meeting will be 9 sessions. It has exchanged 50 games and 9 large micro-communities, providing a professional platform for technical exchange and discussion, promotion and cooperation for the domestic electronics manufacturing industry.
2017-05-04
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Technical points of solder wire for robot automatic welding
The solder wire used for soldering electronic components is composed of a metal alloy and an auxiliary agent. The solder wire is soldered to the soldering iron to complete the welding. The soldering iron provides stable and continuous heat of fusion, and the solder wire is added to the electron as a filler. In the surface and gap of the components, the fixed electronic components become the main components of the solder. The composition of the solder wire is inseparable from the quality of the solder wire, which will affect the chemical properties, mechanical properties and physical properties of the solder wire.
2017-06-01
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Ultra-fine pitch development trend on new requirements for solder paste
Aselectronicproductsmovetowardshorter,smaller,lighter,andthinnerdirections,packagingdevicesareshiftingtowardsmaller,thinner,faster,moreconvenient,andmorereliablestructuraltrends.Underthismarkettrend,01005devicesand0.35MMpitchchipssmallerthan0201Thedevicehasbeenpromotedandapplied,whichmeansthatthedifficultyofSMTassemblywillbegreatlyimproved.Theminiaturizationofthepadsizeandpitchwillmakethesolderingandsolderingofthesolderpastesignificantmoredifficult.Now,theNo.4powdersolderPastewillbedifficulttomeetthedemandinthe01005deviceandthe0.35mmfinepitchchipprinting.Howtoimprovethequalityandimprovethequality?Thereliabilityofsolderjointsputsnewdemandsontheapplicationperformanceofsolderpaste.anewgenerationoffinepowder---5powderlead-freesolderpastewillbecomethetrendoftheindustry.ThepapermainlytestsandevaluatestheprintingandsolderingperformanceofNo.4powderandNo.5powderlead-freesolderpasteonhigh-endsmartphonesandspecialtestboards.Throughvariousdatacollection,thedifferencesareanalyzedandanewgenerationisNo.5powdersolderpastecanfullymeettheprintingrequirementsof0.35mmultra-finepitchchipand01005padsettingandtheweldingrequirementsundernitrogenatmosphere,soastoselectmoresuitablesolderpasteandstencilforweldingonfinerpadinThefuture.Holesprovideareference.1.Thedifficultyofsolderingprocesscausedbythetrendofdevicepackageminiaturization1.1ThetrendofminiaturizeddevicepackagingCHIPcomponent(passivecomponent)andpadsizechange(unit:mm)Table1Ascanbeseenfromtheabovetable,whenthecomponentsizeischangedfrom0402to01005,thepadareawillbereducedby85%.BGAcomponent(activecomponent)pitchandpadsizechange(unit:mm)Table2Ascanbeseenfromtheabovetable,whentheBGApitchischangedfrom0.5to0.3,thepadareaisreducedby50%. 1.2Padsizereductioncorrespondstostencilopeningrequirements IPC-7525网板开孔要求 Arearatioandaspectratioofdifferentstencilthicknessesondifferentdevicepads(openingratio1:1)Table3Arearatioandaspectratio(BGAcircularopening)obtainedbydifferenttemplatethicknessesondifferentBGAsTable41.3Thethicknessofthestencilisinverselyproportionaltothearearatio(AR).Therefore,whenthestencilopeningisreduced,thethicknessofthestencilmustbereducedinordertoobtainastandardarearatio.1.4Thefinerthepadsizeandpitch,thehigherthedifficultyofsolderingtinpaste,andthevolumeoftincanbereducedbymultiples.Increasedweldingdifficulty.1.5Reducingthepadsizeandpinpitch.Toachievethestandardtin-to-tinarearatio,itcanonlybeachievedbythinningthethicknessofthestencil,butthiswillgreatlyreducethevolumeoftinunderthesolderpaste,nodoubt,thisItwillaffectthewelding;forexample,theNo.4powdersolderpasteisusedtoproducehigh-endsmartphoneproductswithhighassemblydensity.Thisproducthasmultiple0.4mmpitchBGAsandlargestructuralpartsandplaneframes,with0.1mmthickness.Thestencil,the0.8mmpitchBGAobtainedAR=0.625<0.66,whichcausedthebadsolderingortinningintheBGAprinting,butthe0.08mmthickstencilandthe0.4mmpitchBGA.AR=0.781≧0.66,theidealtineffectcanbeobtained,butforthestructuralpartsandtheplaneframewithalargeamountoftin,itiseasytocausefalsesolderingbecauseofinsufficienttincontent.Howcanthetwoproblemsbeeffectivelysolved?Canimproveweldingyield?TheselectionofNo.5powdersolderpastehasbecomeatrendinthedevelopmentoftheindustry. 2.Theeffectofsolderpastepowderdiameteronprintingandsoldering2.1DifferencesinpowderdiameterbetweenNo.4powderandNo.5powderNo.4powderparticlestateandparticlesizedistribution(standardparticlesizerange20-38UM)Table5 No.5powderparticlestateandparticlesizedistribution(standardparticlesizerange15-25UM)Table6 Usingtheparticlesizeofthemicroparticleimageanalyzertodetecttheparticlesizeofthepowder,itwasfoundthatthepowderdiameteroftheNo.4powderwasdistributedat30-35UM,whilethepowderdiameteroftheNo.5powderwasdistributedat18-25UM,indicatingthatthepowderdiameterofNo.5powderItis10UMlessthantheNo.4powderdiameter. 2.2Therelationshipbetweenthediameteroftheparticlesandtheweldingofthestencil Five-balllaw:Thethicknessofthesteelmeshisgenerallynotlessthanfourtimesthediameterofthesolderpasteparticles,preferablyfivetimes.Theminimumrectangularopeningforasteelmeshisgenerallynolessthanfivetimesthatofsolderpasteparticles.Forthesmallestcircularwindowopeningisgenerallynotlessthaneighttimesthesolderpasteparticles.Toensuresucharelationship,wecanensureabetterweldquality. RelationshipbetweentinpowderparticlesandstencilopeningsTable7ItcanbeseenfromTable7thatwiththetwocommonlyusedstencilopeningmethods,No.4canonlysatisfythe"three-balllaw",andNo.5powdercansatisfythe"five-balllaw",sothatgoodprintingandprintingcanbeobtained.Weldingquality. 2.3DifferencesinsurfaceoxygencontentbetweenNo.4powderandNo.5powder Ascanbeseenfromtheabovetable,thefinerthetinpowder,thehighertheoxygencontentonthesurface,indicatingthatmoresolderpasteisneededtoremovetheoxidationduringsoldering.2.4ComparisonoflowertinofdifferentpowderdiametersAccordingtothecommonstencilopeningmethodofthecurrentindustrysmartphoneproducts(0.4mmPITCHBGAopen0.235mm,squaretype,chamfer0.5R),thetwosteelmeshesof0.08and0.1MMareusedforprintingandtincontrast.2.4.1Comparisonofsolderpasteformingeffectsafterprint
2018-08-03
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