Welcome to the official website of Shenzhen Weite New Material Co., Ltd.! !

返回

PRODUCT CENTER

Solder ball

没有此类产品
Page view:
Product details
Model 1
Model 2

First, the product introduction

In order to adapt to the development of modern microelectronics industry, as an important auxiliary material for BGA and CSP in IC production, solder balls are widely used in modern microelectronics. They are notebook computers, mobile communication devices, computer motherboards, light-emitting diodes, liquid crystal displays, PDAs, The technical auxiliary materials necessary for the production of functional ICs, such as digital camera, play a vital role in the miniaturization process of large-scale integrated circuits. At present, the market demand for solder balls is very large, with an annual growth rate of nearly 90%. In particular, high-precision, small-diameter solder balls are seriously out of stock.

Our company has direct reading spectrometer, scanning electron microscope, inductively coupled plasma mass spectrometer, surface analysis technology XPS and so on. Excellent R&D team and experienced field technicians guarantee high quality products. The high production efficiency and output make the price of the product have a strong competitive advantage in the same industry. The powerful analytical instruments and control equipment ensure zero defect of the product.

Second, product features

1. The size range of solder balls ranges from 80 microns to 600 microns in diameter;
2. The deviation of the particle size of the solder ball is almost zero, and the ball and the ball show a high degree of consistency;
3. Precisely control the oxygen content of the solder ball;
4, long storage time, usually two years of validity
5, according to customer needs, add trace elements (Ni, Ge, Sb, etc.)

Third, the main push products

Our company produces lead-free solder balls: SAC, SnAg, SnBi, and SnSb. In addition, trace elements such as Ni, Ge, Sb, etc. can be added according to product requirements; leaded solder balls are: SnPb, SnPbAg, and high-lead alloys.

The commonly used alloy series: Sn98.5Ag1Cu0.5, Sn99Ag0.3Cu0.7, Sn96.5Ag3Cu0.5, Sn95.5Ag4Cu0.5, Sn63Pb37, Sn5Pb92.5Ag2.5, Sn10Pb90, Sn62Pb36Ag2.

The company's commonly used solder balls range in size from 200μm to 600μm. In addition, the solder balls below 200μm can also meet the needs of customers.

Fourth, the production process

1

Corresponding parameter set not found, please add it in property template of background
暂未实现,敬请期待
暂未实现,敬请期待

ABOUT US

  • patented product

    Having 32 Core Independent Intellectual Property Rights

  • National High-tech Enterprises

    Strong R&D and innovation capability

  • ISO 9001 International System

    China Quality Certification Accreditation Organization

  • world top 500 Honorary customer

    Gree, ZTE and Foxconn

National Service Hotline0755-61863001