PRODUCT CENTER
Solder paste 3
Classification |
Product Line |
Features |
Applications |
Electrical Assembly Solder Paste |
General Lead-Free Solder Paste System |
Excellent continuous printability, reflow process window width Low residual, full and bright solder joints High surface insulation resistance, low void rate |
This product can be used with bare copper, gold plate, tin plate, OSP and other surface-treated PCB boards and other lead-free solder alloy components in computer motherboards, graphics cards, communications Widely used equipment, audio and video equipment, refrigeration equipment, vehicle equipment, instrumentation, medical equipment, etc. |
Super fine pitch printing paste series |
The fine pitch printing is full of tin, good anti-collapse and strong anti-oxidation ability very low void rate, good soldering performance Good ICT test performance |
Mobile phones, camcorders, precision medical equipment, avionics, etc. |
|
Leading solder paste series |
Good wettability, long-term printing is not easy to dry The anti-stamp performance is good and it is not easy to create holes Vertical creeping ability, continuous multi-chip printing without wiping the stencil Low residual, high impedance |
Electronic products such as communication, IT, security, medical equipment, toys, etc. |
|
LED solder paste |
LED special solder paste series |
Excellent solderability, full solder on the solder joints, bright, strong tin-plated, low soldering rate High surface insulation resistance and reliable electrical performance The product has less residue and a light residual color |
This product can be widely used with LED displays, LED power supplies and LED peripheral products |
Low temperature solder paste |
Through hole low temperature solder paste series |
Low melting point, suitable for different printing processes Excellent printability, good wettability, bright solder joints wide process and fast printing |
LED components, tuner, FPC soft cable, charging Electronics, toys and other electronic products |
Distributor Module Solder Paste Series |
Low melting point, low thermal resistance, high thermal conductivity Good fluidity and high welding strength Welding process window width, low bubble and void rate |
This product can be used with lead-free low-temperature solder alloy components in high-power LED components, heat sinks, tuner, FPC flexible cable, high temperature resistant components and It needs to be widely used in electronic appliances such as soldering and soldering circuit boards. |
|
Chip, semiconductor package solder paste |
Chip Package Solder Paste Series |
High thermal conductivity, low residual, low void The solder joints are bright, strong, and non-corrosive Good Dispensing and Printing Process |
Crystal solder paste is suitable for all small, medium and high power LED lamp bead packages with solderable coating metals, such as plating: Au, Cu, Ni, Ag, etc. Solder metal layer. |
Component package solder paste series |
High melting point, high strength, low hole Less residual, easy to clean Good Dispensing and Printing Process |
Applicable to power tube, diode, three-stage tube, thyristor, rectifier, small integrated circuit and other package soldering, long-lasting printing, bright solder joints, low porosity, and at the same time Meet printing and automatic dispensing. |
Syringes: 10g / support, 30g / support, 100g / support, 200g / support, 500g / support, 1250g / support can also be packaged according to customer needs.
ABOUT US
-
patented product
Having 32 Core Independent Intellectual Property Rights
-
National High-tech Enterprises
Strong R&D and innovation capability
-
ISO 9001 International System
China Quality Certification Accreditation Organization
-
world top 500 Honorary customer
Gree, ZTE and Foxconn