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Solder paste 3

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Product details
Model 1
Model 2
First, the product introduction
 
Victaulic solder paste is completely self-developed and has a number of national invention patents. Weite's series of no-clean lead-free solder paste is a solder paste that is developed according to IPC and JIS and other international standards to meet future environmental requirements. It uses a new rosin resin and composite anti-oxidation technology, and uses a low-oxidation sphere. Solder alloy powder and paste-like environmentally friendly flux with strong chemical stability. Suitable for all kinds of precision welding in the electronic assembly process SMT production.
 
We only have a wide range of solder pastes, including mobile phone special solder paste, chip semiconductor package solder paste, LED special solder paste, thermal module low temperature solder paste and so on. The alloy has a melting point of up to 138 °C and a maximum of 287 °C. The alloys are available in a wide range of alloys to suit a wide range of industries and products.
 
Second, solder paste characteristics

Classification

Product Line

Features

Applications

Electrical Assembly Solder Paste

General Lead-Free Solder Paste System

Excellent continuous printability, reflow process window width

Low residual, full and bright solder joints

High surface insulation resistance, low void rate

This product can be used with bare copper, gold plate, tin plate, OSP and other surface-treated PCB boards and other lead-free solder alloy components in computer motherboards, graphics cards, communications Widely used equipment, audio and video equipment, refrigeration equipment, vehicle equipment, instrumentation, medical equipment, etc.

Super fine pitch printing paste series

The fine pitch printing is full of tin, good anti-collapse and strong anti-oxidation ability

very low void rate, good soldering performance

Good ICT test performance

Mobile phones, camcorders, precision medical equipment, avionics, etc.

Leading solder paste series

Good wettability, long-term printing is not easy to dry

The anti-stamp performance is good and it is not easy to create holes

Vertical creeping ability, continuous multi-chip printing without wiping the stencil

Low residual, high impedance

Electronic products such as communication, IT, security, medical equipment, toys, etc.

LED solder paste

LED special solder paste series

Excellent solderability, full solder on the solder joints, bright, strong tin-plated, low soldering rate

High surface insulation resistance and reliable electrical performance

The product has less residue and a light residual color

This product can be widely used with LED displays, LED power supplies and LED peripheral products

Low temperature solder paste

Through hole low temperature solder paste series

Low melting point, suitable for different printing processes

Excellent printability, good wettability, bright solder joints

wide process and fast printing

LED components, tuner, FPC soft cable, charging

Electronics, toys and other electronic products

Distributor Module Solder Paste Series

Low melting point, low thermal resistance, high thermal conductivity

Good fluidity and high welding strength

Welding process window width, low bubble and void rate

This product can be used with lead-free low-temperature solder alloy components in high-power LED components, heat sinks, tuner, FPC flexible cable, high temperature resistant components and It needs to be widely used in electronic appliances such as soldering and soldering circuit boards.

Chip, semiconductor package solder paste

Chip Package Solder Paste Series

High thermal conductivity, low residual, low void

The solder joints are bright, strong, and non-corrosive

Good Dispensing and Printing Process

Crystal solder paste is suitable for all small, medium and high power LED lamp bead packages with solderable coating metals, such as plating: Au, Cu, Ni, Ag, etc. Solder metal layer.

Component package solder paste series

High melting point, high strength, low hole

Less residual, easy to clean

Good Dispensing and Printing Process

Applicable to power tube, diode, three-stage tube, thyristor, rectifier, small integrated circuit and other package soldering, long-lasting printing, bright solder joints, low porosity, and at the same time Meet printing and automatic dispensing.

 

Third, the application guide
 
1, save and use
The product should be sealed and stored at 2-10 ° C with a shelf life of 6 months (from the date of production).
The solder paste should be removed from the freezer before use. Leave the bottle cap open and leave it at room temperature. To achieve complete heat balance,
It is recommended to have a warm-up time of at least 4 hours.
After returning to the temperature, the solder paste should be thoroughly stirred by a manual or solder paste automatic mixer for 1-3 minutes before use, so that the solder paste and the solder alloy powder are thoroughly stirred to avoid unevenness caused by storage. The specific mixing time should be based on the stirring speed,
The ambient temperature and other factors are determined.
Do not use used solder paste in the same container as unused solder paste. After the solder paste is opened, if there is any solder paste left in the jar, it should not be placed in the air. The lid should be tightened as soon as possible.
 
2, printing
The recommended printing parameters for solder paste are as follows:
Scraper: stainless steel scraper or polyurethane scraper
Scraper printing angle: 40 ° ~ 60 °
Printing method: suitable for manual printing, semi-automatic or fully automatic machine printing
Printing speed: 20 ~ 100mm / sec
Printing residence time: After solder paste printing, component placement and soldering should be completed as soon as possible, and the residence time should not exceed 12 hours.
In order to avoid affecting component placement and soldering effect temperature/humidity: temperature 25±5°C, relative humidity 50±10%
 
3, point coating
The appropriate needle can be selected and the appropriate air pressure adjusted according to the size of the product and the dispensing speed.
 
4, packaging
Bottled 500g package;

Syringes: 10g / support, 30g / support, 100g / support, 200g / support, 500g / support, 1250g / support can also be packaged according to customer needs. 

Corresponding parameter set not found, please add it in property template of background
暂未实现,敬请期待
暂未实现,敬请期待
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