Solder paste 3

Classification

Product Line

Features

Applications

Electrical Assembly Solder Paste

General Lead-Free Solder Paste System

Excellent continuous printability, reflow process window width

Low residual, full and bright solder joints

High surface insulation resistance, low void rate

This product can be used with bare copper, gold plate, tin plate, OSP and other surface-treated PCB boards and other lead-free solder alloy components in computer motherboards, graphics cards, communications Widely used equipment, audio and video equipment, refrigeration equipment, vehicle equipment, instrumentation, medical equipment, etc.

Super fine pitch printing paste series

The fine pitch printing is full of tin, good anti-collapse and strong anti-oxidation ability

very low void rate, good soldering performance

Good ICT test performance

Mobile phones, camcorders, precision medical equipment, avionics, etc.

Leading solder paste series

Good wettability, long-term printing is not easy to dry

The anti-stamp performance is good and it is not easy to create holes

Vertical creeping ability, continuous multi-chip printing without wiping the stencil

Low residual, high impedance

Electronic products such as communication, IT, security, medical equipment, toys, etc.

LED solder paste

LED special solder paste series

Excellent solderability, full solder on the solder joints, bright, strong tin-plated, low soldering rate

High surface insulation resistance and reliable electrical performance

The product has less residue and a light residual color

This product can be widely used with LED displays, LED power supplies and LED peripheral products

Low temperature solder paste

Through hole low temperature solder paste series

Low melting point, suitable for different printing processes

Excellent printability, good wettability, bright solder joints

wide process and fast printing

LED components, tuner, FPC soft cable, charging

Electronics, toys and other electronic products

Distributor Module Solder Paste Series

Low melting point, low thermal resistance, high thermal conductivity

Good fluidity and high welding strength

Welding process window width, low bubble and void rate

This product can be used with lead-free low-temperature solder alloy components in high-power LED components, heat sinks, tuner, FPC flexible cable, high temperature resistant components and It needs to be widely used in electronic appliances such as soldering and soldering circuit boards.

Chip, semiconductor package solder paste

Chip Package Solder Paste Series

High thermal conductivity, low residual, low void

The solder joints are bright, strong, and non-corrosive

Good Dispensing and Printing Process

Crystal solder paste is suitable for all small, medium and high power LED lamp bead packages with solderable coating metals, such as plating: Au, Cu, Ni, Ag, etc. Solder metal layer.

Component package solder paste series

High melting point, high strength, low hole

Less residual, easy to clean

Good Dispensing and Printing Process

Applicable to power tube, diode, three-stage tube, thyristor, rectifier, small integrated circuit and other package soldering, long-lasting printing, bright solder joints, low porosity, and at the same time Meet printing and automatic dispensing.