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Preformed solder tab

Preformed solder tab

In the existing SMT process, the thickness of the alloy used for soldering in the solder paste is only half of the volume of the solder paste, so sometimes the solder paste cannot provide sufficient solder amount, solder joint strength and solder coverage. The situation can not meet the requirements. Many problems, such as proper hole filling, SMT package pin coplanarity, and RF patch warpage, generally require more solder to achieve acceptable mechanical reliability.
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